IPC Workshop: Quantifying the Major Sources of PCB Process Variability.Sunday, March 23, 2003: 8:30 am - 4:00 pm.
Long Beach Convention Center, Long Beach, California, USA
|Presented by Mario Perez-Wilson|
|Workshop Text||Workshop Description|
|Is the variability affecting your Cu Plating Process coming from within a board, board-to-board, within panel, panel-to-panel, across the flight bar, flight-bar to flight-bar, within a tank, tank-to-tank, within a shift, or from shift-to-shift? Or is it really coming from day-to-day variation. There are a multitude of sources of variability in PCB fabrication processes. These processes are complicated systems comprised of mechanical, chemical and electrochemical processes. Analysis of Variance is the key to unequivocally quantifying these sources of variability and then conduct statistically designed experiments to correct the problem permanently. We would be exploring key PCB processes and how to determine their sources of variability.|
|What You Will Learn|
|This is what you will learn from this one-time-only workshop:
ANOVA, Analysis of Variance,
Sum-of-squares and Variance approach to ANOVA,
Quantifying correctly within board, board-to-board, within panel and panel-to-panel variability,
How to detect and quantify the major sources of PCB variability,
Characterizing a Cu plating process,
Understanding and using confidence and risk in process decision making,
PCB Process Characterization - Applying M/PCpS to the PCB Industry,
Detecting interactions and what to do about them,
Defining experimental design models,
Process Characterization and quantifying process variability.
|Tutorial and Workshop Program||Who Should Attend|
||VP of Engineering,
VP of Quality,
VP of Operations,
Directors of Engineering,
Directors of Operations,
Directors of Quality,
Production, Manufacturing and Process Engineers.
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Scottsdale, Arizona 85261-5257