IPC Workshop: Quantifying the Major Sources of PCB Process Variability.

Sunday, March 23, 2003: 8:30 am - 4:00 pm.
Long Beach Convention Center, Long Beach, California, USA

Presented by Mario Perez-Wilson

Workshop Text	Workshop Description
	Is the variability affecting your Cu Plating Process coming from within a board, board-to-board, within panel, panel-to-panel, across the flight bar, flight-bar to flight-bar, within a tank, tank-to-tank, within a shift, or from shift-to-shift? Or is it really coming from day-to-day variation. There are a multitude of sources of variability in PCB fabrication processes. These processes are complicated systems comprised of mechanical, chemical and electrochemical processes. Analysis of Variance is the key to unequivocally quantifying these sources of variability and then conduct statistically designed experiments to correct the problem permanently. We would be exploring key PCB processes and how to determine their sources of variability.

Workshop Text

Workshop Description

Is the variability affecting your Cu Plating Process coming from within a board, board-to-board, within panel, panel-to-panel, across the flight bar, flight-bar to flight-bar, within a tank, tank-to-tank, within a shift, or from shift-to-shift?

Or is it really coming from day-to-day variation.

There are a multitude of sources of variability in PCB fabrication processes.

These processes are complicated systems comprised of mechanical, chemical and electrochemical processes.

Analysis of Variance is the key to unequivocally quantifying these sources of variability and then conduct statistically designed experiments to correct the problem permanently.

We would be exploring key PCB processes and how to determine their sources of variability.

What You Will Learn
This is what you will learn from this one-time-only workshop: Analyzing differences in Mean using the Variance, ANOVA, Analysis of Variance, Sum-of-squares and Variance approach to ANOVA, Quantifying correctly within board, board-to-board, within panel and panel-to-panel variability, How to detect and quantify the major sources of PCB variability, Characterizing a Cu plating process, Understanding and using confidence and risk in process decision making, PCB Process Characterization - Applying M/PCpS to the PCB Industry, Detecting interactions and what to do about them, Defining experimental design models, Process Characterization and quantifying process variability.

What You Will Learn

This is what you will learn from this one-time-only workshop:

Tutorial and Workshop Program	Who Should Attend
When Sunday, March 23, 2003: 8:30 am - 4:00 pm. Where Long Beach Convention Center, Long Beach, California, USA Register Register by Mail: IPC Printed Circuits Expo 107 Waterhouse Rd. Bourne, MA 02532 Questions Call: 847-790-5361 Register On-Line www.ipcprintedcircuitexpo.org by email: expoinfo@ipc.org	VP of Engineering, VP of Quality, VP of Operations, Directors of Engineering, Directors of Operations, Directors of Quality, Engineering Managers, Production, Manufacturing and Process Engineers.

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